2013光互連的機(jī)遇 市場(chǎng)和技術(shù)預(yù)測(cè)第二卷

        中文：《光互連的機(jī)遇：市場(chǎng)和技術(shù)預(yù)測(cè)--2013-2020》（第二卷：On-Chip和Chip-to-Chip）
        英文：Revenue Opportunities for Optical Interconnects: Market and Technology Forecast - 2013-2020（Volume II: On-Chip and Chip-to-Chip）
發(fā)布時(shí)間：2013年7月

        報(bào)告簡(jiǎn)介

        近年來(lái)，關(guān)于集成電路（IC）制造的傳統(tǒng)架構(gòu)和材料方面的假設(shè)受到挑戰(zhàn)，半導(dǎo)體行業(yè)則正在尋找新的解決方案。此外，半導(dǎo)體行業(yè)的能源和散熱問(wèn)題使得這一危機(jī)更加凸顯。

        其中最重要的問(wèn)題之一就是所謂的“互連瓶頸”，即On-Chip和Chip-to-Chip都會(huì)同時(shí)出現(xiàn)的數(shù)據(jù)流量堵塞趨勢(shì)?；ミB瓶頸在摩爾定律完全失去動(dòng)力的很久以前就已經(jīng)出現(xiàn)，它現(xiàn)在是以不同的形式重新出現(xiàn)在為使芯片封裝更容易的新的架構(gòu)中。

        “明顯的”解決方案是采用光學(xué)這一解決帶寬問(wèn)題常用的方式。但是針對(duì)On-Chip和Chip-to-Chip互連的光學(xué)解決方案在商用產(chǎn)品的開(kāi)發(fā)方面比較困難。生產(chǎn)能被用在芯片層級(jí)的足夠小和低廉的光子器件是一個(gè)很大的難題。

        在這份報(bào)告中，CIR分析了光互連在芯片層級(jí)的最新發(fā)展以及世界各地的重要研究小組在這個(gè)領(lǐng)域取得的進(jìn)展。報(bào)告同時(shí)討論了研發(fā)和商用方面的進(jìn)展。該報(bào)告從傳統(tǒng)CPU芯片以及最新架構(gòu)的角度來(lái)看待這個(gè)問(wèn)題，同時(shí)還分析了相對(duì)于金屬互連和未來(lái)可能出現(xiàn)的其它比光子更奇特的替代解決方案（尤其是碳納米管）而言，光互連所存在的發(fā)展機(jī)遇。

        報(bào)告里面還包括了未來(lái)十年的演進(jìn)路線圖。該路線圖展示了芯片層級(jí)光互連商業(yè)機(jī)會(huì)的出現(xiàn)時(shí)機(jī)、應(yīng)用領(lǐng)域及其市場(chǎng)規(guī)模。CIR還分析了領(lǐng)導(dǎo)廠商及其在設(shè)計(jì)和實(shí)施On-Chip & Chip-to-Chip光互連方面的研究工作。

        參考目錄

        Executive Summary
        執(zhí)行者摘要

E.1 Opportunities and Business Models for Photonics Firms
E.2 How the Semiconductor Industry Will Use Optical Interconnection as an Enabling
Technology
E.3 Summary of Key R&D Directions for On-Chip and Chip-to-Chip Optical Interconnection
E.4 Eight Companies and Other Organization that Will Create Photonic Interconnection for
Chip-Level Interconnection
E.5 Roadmap and Summary 10-year Forecast for Chip Level Interconnection

Chapter One: Introduction
第一章：報(bào)告簡(jiǎn)介
1.1 Background to this Report
1.2 Objective and Scope of this Report
1.3 Methodology of this Report
1.4 Plan of this Report

Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection
第二章：On-Chip & Chip-to-Chip互連需求分析
2.1 Limits to Electronic Interconnects
2.2 Moore’s Law, Scaling and Interconnection
2.2.1 Current Prognosis for Moore’s Law
2.2.2 Impact on Interconnection
2.3 Multi-Core Processors Breed New Interconnection Problems
2.4 So Do 3D Chips
2.5 Potential for Moving to Non-Silicon Chips: Carbon Nanotubes, Graphene, Quantum Dots
2.5.1 Impact on Interconnection
2.6 A Possible Transition to Optical Computing
2.6.1 Impact on Interconnection
2.7 Key Points Made in this Chapter

Chapter Three Technologies for On-Chip/Chip-to-Chip Interconnection
第三章：On-Chip & Chip-to-Chip互連的三種技術(shù)
3.1 Current Optical Assemblies for Chip-to-Chip Interconnection
3.2 Emerging Laser Technology for Chip-Based Interconnections
3.2.1 VCSELs
3.2.2 Quantum Dot Lasers
3.2.3 Other Technologies
3.3 Emerging Detector Technology for Chip-Based Interconnection
3.4 Emerging Modulator Technology for Chip-Based Interconnection
3.5 Ten-Year Road Map and Revenue Forecast for Chip-Based Optical Interconnection
3.6 The Role of Optical Integration in Future Chip-Based Interconnection
3.6.1 Silicon Photonics
3.6.2 Indium Phosphide and Other Inorganic Semiconductors
3.6.3 The Role of Polymer Waveguides in Chip-Based Interconnection
3.6.4 Ten-Year Road Map and Revenue Forecast for Optical Integration in Chip-Based Optical
Interconnection
3.7 Other Alternatives to Optics for Advanced Interconnection
3.7.1 Carbon Nanotubes
3.7.2 Other
3.8 Key Points Made in this Chapter

    附：《光互連的機(jī)遇：市場(chǎng)和技術(shù)預(yù)測(cè)--2013-2020》（第一卷：板對(duì)板和機(jī)架到機(jī)架）